White thermosetting silicone resin composition for molding an optical semiconductor case and optical semiconductor case
US8013057B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2009 |
| Grant date | Sep 6, 2011 |
| Priority date | — |
| Expiry date | Sep 4, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A white thermosetting silicone resin composition for molding an optical semiconductor case and a case for an optical semiconductor such as LED are provided. The composition comprises (A) a thermosetting organopolysiloxane, (B) a white pigment, (C) an inorganic filler (excluding the white pigment), (D) a condensation catalyst, and (E) a coupling agent represented by the following formula: R3dSi(OR2)e wherein R3 represents an organic group containing a mercapto group, a glycidyl group, or an amino group, R2 represents a C1-4 organic group, d represents 1 or 2, and e represents 2 or 3; wherein content of the white pigment (B) is 1 to 50% by weight in the entire composition, and total content of the white pigment (B) and the inorganic filler (C) is 70 to 93% by weight in the entire composition. When cured, it has excellent whiteness, consistency, and resistance to heat, light, yellowing, and warping.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.