Printed circuit board
US8013254B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2008 |
| Grant date | Sep 6, 2011 |
| Priority date | — |
| Expiry date | Nov 21, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09781
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a printed circuit board (PCB) comprising a first ground layer extended in one direction a first dielectric layer laminated on the first ground layer and extended in the same direction as that of the first ground layer; a signal transmission line laminated on the first dielectric layer and extended in the same direction as that of the first dielectric layer; and a plurality of first ground patterns formed by etching a surface of the first ground layer in an axial direction thereof at a predetermined interval in a line, wherein the plurality of first ground patterns expose the first dielectric layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.