Chip coated light emitting diode package and manufacturing method thereof
US8013352B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 8, 2010 |
| Grant date | Sep 6, 2011 |
| Priority date | — |
| Expiry date | Jan 8, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8516
Abstract
A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.