Side view light emitting diode package
US8013357B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2009 |
| Grant date | Sep 6, 2011 |
| Priority date | — |
| Expiry date | Jul 1, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8506
Abstract
Provided is a side view light emitting diode package including a housing that includes a front side part and a rear side part integrally formed with the front side part, the front side part having a light emission part; and a lead frame that is located between the front side part and the rear side part, wherein the lead frame includes a first lead connected to a first electrode of a Light Emitting Diode (LED) chip and a second lead connected to a second electrode of the LED chip, wherein the front side part includes a first groove, a second groove, and a third groove, wherein the first lead and the second lead are extended through the first groove and the second groove, respectively, and a heat dissipation part is extended from the first lead through the third groove to an outside of the LED package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.