Virtual wire assembly having hermetic feedthroughs
US8013433B2 · kind B2 · utility
1Cited by
39References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2006 |
| Grant date | Sep 6, 2011 |
| Priority date | — |
| Expiry date | Jul 6, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A virtual wire assembly that includes a substantially electrically-nonconductive substrate and a plurality of hermetic feedthroughs including a conductive region extending transversely through the substrate to form a conductive pathway with accessible surfaces at opposing ends thereof, wherein each conductive pathway is electrically isolated from other conductive pathways. In certain embodiments of this aspect of the invention, the substantially electrically-nonconductive substrate is a semiconductor device, and the conductive regions each include an n-type or a p-type doped semiconductor material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.