Wiring substrate and display device including the same
US8013454B2 · kind B2 · utility
15Cited by
5References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2006 |
| Grant date | Sep 6, 2011 |
| Priority date | — |
| Expiry date | Dec 18, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/167
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An active matrix substrate includes a first substrate, a driving integrated circuit chip mounted on the first substrate with an anisotropic electrically conductive layer, and an insulating member. The insulating member isolates a terminal from a wiring and a bump electrode that are adjacent to the terminal portion and isolates a bump electrode facing the terminal portion from a bump electrode and a wiring that are adjacent to the bump electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.