Spectroscopy module
US8013993B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 12, 2009 |
| Grant date | Sep 6, 2011 |
| Priority date | — |
| Expiry date | Dec 27, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01J2003/1213
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In a spectroscopy module 1, a light passing hole 50 through which a light L1 advancing to a spectroscopic portion 4 passes is formed in a light detecting element 5. Therefore, it is possible to prevent the relative positional relationship between the light passing hole 50 and a light detecting portion 5a of the light detecting element 5 from deviating. Moreover, the light detecting element 5 is bonded to a front plane 2a of a substrate 2 with an optical resin adhesive 63. Thus, it is possible to reduce a stress generated onto the light detecting element 5 due to a thermal expansion difference between the light detecting element 5 and the substrate 2. Additionally, the light transmissive plate 16 covers a part of a light incident opening 50a. Thus, a light incident side surface 63a of the optical resin adhesive 63 becomes a substantially flat plane in the light passing hole 50. Therefore, it is possible to make the light L1 appropriately incident into the substrate 2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.