HD physical layer of a wireless communication device

US8014416B2 · kind B2 · utility

Assignee

• SiBEAM, Inc. · US

Inventors

• Keangpo Ricky Ho · San Jose, US
• Karim Nassiri-Toussi · Belmont, US
• Dengwei Fu · Los Altos, US
• Stephen Pope · Ashton, CA
• Jeffrey M. Gilbert · Palo Alto, US
• Chuen-Shen Bernard Shung · San Jose, US
• Jianhan Liu · San Jose, US

Key dates

• Filing date: Feb 13, 2007
• Grant date: Sep 6, 2011
• Expiry date: May 7, 2030

Classification

• Technology area (CPC H): Electricity
• CPC primary: H04W88/02
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

A radio frequency (RF) transmitter is coupled to and controlled by a processor to transmit data. A physical layer circuit is coupled to the RF transmitter to encode and decode between a digital signal and a modulated analog signal. The physical layer circuit comprises a high rate physical layer circuit (HRP) and a low rate physical layer circuit (LRP). The low rate channels generated by the low rate physical layer circuit (LRP) share a same frequency band as a corresponding high rate channel generated by the high rate physical layer circuit (HRP).