Heat pump for high temperature environments
US8015830B2 · kind B2 · utility
0Cited by
17References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 20, 2009 |
| Grant date | Sep 13, 2011 |
| Priority date | — |
| Expiry date | Oct 7, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01M2008/1293
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A component has an outer wall defining an interior chamber to be cooled. Electronic equipment is mounted within the outer wall in the chamber. A thermoelectric cooler has a cool node positioned to be within the chamber, and a hot node positioned outwardly of the outer wall. A fuel cell provides electricity to the thermoelectric cooler. The fuel cell is mounted outwardly of the outer wall.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.