Apparatus and method for manufacturing optical elements
US8016582B2 · kind B2 · utility
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13Claims
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Key dates
| Filing date | Jun 5, 2009 |
| Grant date | Sep 13, 2011 |
| Priority date | — |
| Expiry date | Nov 7, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S425/808
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An apparatus for manufacturing optical elements at wafer level includes a lower mold core, an upper mold core, an aligning plate and an image pick-up device. The lower mold core has a lower alignment mark. The upper mold core has an upper alignment mark. The aligning plate has a first middle alignment mark corresponding to the lower alignment mark and a second middle alignment mark corresponding to the upper alignment mark. The image pick-up device is configured for capturing and analyzing images of the alignment marks to align the lower mold core, the aligning plate and the upper mold core.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.