Desiccant sealing arrangement for OLED devices
US8016631B2 · kind B2 · utility
10Cited by
37References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2007 |
| Grant date | Sep 13, 2011 |
| Priority date | — |
| Expiry date | Dec 5, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K2102/3026
Abstract
A method of encapsulating an OLED device includes forming an OLED device on a substrate; providing a protective cover surrounding the OLED device and the substrate; providing a first sealing arrangement between the protective cover and top surface of the substrate, to define a first chamber enclosing the OLED device; providing a second sealing arrangement sealed to define a second chamber sealed from and enclosing the first chamber; and providing first desiccant material in the first chamber and providing second desiccant material in the second chamber closer to the bottom surface of the substrate than the top surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.