Metal fluid distribution plate with an adhesion promoting layer and polymeric layer
US8017280B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 13, 2005 |
| Grant date | Sep 13, 2011 |
| Priority date | — |
| Expiry date | Mar 6, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In at least one embodiment, the present invention provides an electrically conductive fluid distribution plate and a method of making, and system for using, the electrically conductive fluid distribution plate. In at least one embodiment, the plate comprises an electrically conductive fluid distribution plate comprising a metallic plate body defining a set of fluid flow channels configured to distribute flow of a fluid across at least one side of the plate, a metal-containing adhesion promoting layer having a thickness less than 100 nm disposed on the plate body, and a composite polymeric conductive layer disposed on the metal-containing adhesion promoting layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.