Heat-conductive adhesive
US8017674B2 · kind B2 · utility
2Cited by
5References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2007 |
| Grant date | Sep 13, 2011 |
| Priority date | — |
| Expiry date | Feb 20, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/305
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention provides a heat-conductive adhesive with high heat spread properties and excellent handleability. A pitch-based carbon fiber filler with high thermal conductivity and a smooth surface is combined with an adhesive resin to produce a heat-conductive adhesive with controlled viscosity and excellent handleability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.