Plasticizer for resin and resin composition containing the same
US8017677B2 · kind B2 · utility
1Cited by
2References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2007 |
| Grant date | Sep 13, 2011 |
| Priority date | — |
| Expiry date | Mar 28, 2027 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G2190/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A compound having a particular structural formula containing plural alkyl groups connected to each other, such as 9-methylenenonadecane, 2-decyl-2-octyloxirane and the like, is mixed in a resin composition for sealing. Accordingly, a resin composition without surface stickiness is obtained that has low viscosity and excellent thixotropic property before curing, and has excellent adhesion property and low tackiness residual property after curing, which can be favorably used as a resin composition for sealing for construction and automobile.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.