Multi-layered printed circuit board with a conductive substrate and three insulating layers with wiring and ground traces
US8017874B2 · kind B2 · utility
2Cited by
6References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 19, 2009 |
| Grant date | Sep 13, 2011 |
| Priority date | — |
| Expiry date | Feb 21, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0969
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A first insulating layer is formed on a suspension body, and a write wiring trace is formed on the first insulating layer. A second insulating layer is formed on the first insulating layer so as to cover the wiring trace. A write wiring trace is formed, above the write wiring trace, on the second insulating layer. A ground trace is formed on one side of the write wiring trace at a distance on the second insulating layer. A third insulating layer is formed on the second insulating layer so as to cover the wiring trace and the ground trace. An opening is formed in a region, below the write wiring trace, of the suspension body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.