Semiconductor device and manufacturing method of the same
US8018033B2 · kind B2 · utility
47Cited by
2References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 8, 2009 |
| Grant date | Sep 13, 2011 |
| Priority date | — |
| Expiry date | Oct 4, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a wiring board, a semiconductor element mounted on the wiring board, a sealing resin configured to cover the semiconductor element, a ground electrode having an end connected to a wiring layer of the wiring board and an exposing part exposed at a surface of the sealing resin, and a shielding member configured to cover the sealing resin and be connected to the ground electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.