Silicon condenser microphone and manufacturing method
US8018049B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 30, 2007 |
| Grant date | Sep 13, 2011 |
| Priority date | — |
| Expiry date | Jun 9, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49798
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A silicon condenser microphone package and method for manufacture are disclosed. The silicon condenser microphone package includes a silicon condenser microphone die, a substrate comprising a conductive layer, and a cover having a conductive layer, where the conductive layers of the substrate and cover are electrically connected to form an electromagnetic interference shield for the silicon condenser microphone die. The method for manufacturing the silicon condenser microphone package involves placement of a plurality of silicon condenser microphone dies on a panel of printed circuit board material, placement of covers over each of the silicon condenser microphone dies, and then separating the panel into individual packages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.