Circuit board interconnection system, connector assembly, circuit board and method for manufacturing a circuit board
US8018733B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 10, 2010 |
| Grant date | Sep 13, 2011 |
| Priority date | — |
| Expiry date | Dec 10, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49139
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board interconnection system is disclosed according to the embodiments of the present invention. The system includes a first circuit board, a second circuit board, a third circuit board, a first connector and a second connector. The first connector and the second connector are mounted at two sides of the first circuit board respectively so that the second circuit board mounted on the first connector is perpendicular to the third circuit board on the second connector. The first connector and the second connector mounted respectively at two sides of the first circuit board are coupled to each other via an impedance controlled mechanism on the first circuit board. Another circuit board interconnection system, a circuit board, a connector assembly and a method for manufacturing a circuit board are disclosed according to the present invention. The circuit board adopts the impedance controlled mechanism which has a shielding function and an impedance controlled function to replace a via hole on the existing circuit board where the via hole has an uncontrollable resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.