Laser diode package with enhanced cooling
US8018980B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 25, 2010 |
| Grant date | Sep 13, 2011 |
| Priority date | — |
| Expiry date | Jan 25, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/4025
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A laser diode package assembly includes a reservoir filled with a fusible metal in close proximity to a laser diode. The fusible metal absorbs heat from the laser diode and undergoes a phase change from solid to liquid during the operation of the laser. The metal absorbs heat during the phase transition. Once the laser diode is turned off, the liquid metal cools off and resolidifies. The reservoir is designed such that that the liquid metal does not leave the reservoir even when in liquid state. The laser diode assembly further includes a lid with one or more fin structures that extend into the reservoir and are in contact with the metal in the reservoir.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.