Patent · US Active

Printed circuit board bonding device

US8020281B2 · kind B2 · utility

0Cited by

13References

5Claims

0Family size

Assignee

Silverbrook Research Pty Ltd · AU

Inventors

Stephen Richard O'Farrell · Sydney, AU
Jan Waszczuk · Sydney, AU
Stephen John Sleijpen · Sydney, AU
James Philip Andrew · Fawn Drive, AU
Craig Donald Strudwicke · Sydney, AU
William Granger · Sydney, AU
Mark Janos · Sydney, AU

Key dates

Filing date	Aug 19, 2008
Grant date	Sep 20, 2011
Priority date	—
Expiry date	Apr 29, 2029

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/53174
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

The present invention relates to a bonding device for bonding a flexible printed circuit board (PCB) to a printhead assembly. The printhead assembly includes a printhead carrier and an ink ejection printhead carried by the carrier. The bonding device includes a support structure assembly and a first heater assembly arranged on the support structure assembly to be movable along a first path and configured to bond the flexible PCB to the printhead. A bending mechanism is arranged on the support structure and is configured to bend the bonded PCB. A second heater assembly is arranged on the support structure assembly to be movable along a second path and is configured to bond the bent PCB to the printhead carrier. A control system controls operation of the heater assemblies and the bending mechanism.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.