Method of manufacturing a printed wiring board
US8020291B2 · kind B2 · utility
9Cited by
44References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2008 |
| Grant date | Sep 20, 2011 |
| Priority date | — |
| Expiry date | Jun 25, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.