Methods for connecting a wire to a metalized circuit path on a plastic part
US8020744B2 · kind B2 · utility
0Cited by
6References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2010 |
| Grant date | Sep 20, 2011 |
| Priority date | — |
| Expiry date | Feb 27, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H2207/04
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for connecting wires to circuits, including the formation of at least one electrically conductive path having a plastic base with a metal foil formed of laser direct processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.