Mold apparatus for forming polymer and method
US8021135B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2008 |
| Grant date | Sep 20, 2011 |
| Priority date | — |
| Expiry date | Aug 19, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2035/0816
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Various mold apparatuses and methods for forming a polymer with induction heat energy are provided. In one embodiment of the present invention, a mold apparatus for forming polymer includes a mold having a top mold portion and a top mold surface that is magnetic. The bottom mold portion of the mold includes an induction heating unit that is at least partially embedded in the bottom mold portion that provides induction heat energy to the mold. The mold apparatus is constructed and arranged to dissipate greater than about 50% of the induction heat energy in the top mold portion. The induction heating unit of the bottom portion of the mold provides rapid heating to the top mold surface to provide high surface quality polymer parts and a shorter molding cycle time while utilizing less energy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.