Substrate cleaning processes through the use of solvents and systems
US8021490B2 · kind B2 · utility
0Cited by
27References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 4, 2007 |
| Grant date | Sep 20, 2011 |
| Priority date | — |
| Expiry date | Jan 4, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A method for removing common contaminates or residues which include but are not limited to ionic residues, particulate residues and moisture from semiconductor wafers used in the manufacture of IC (integrated circuits), liquid crystal displays and flat panel displays. The process includes the use of certain esters or certain esters combined with particular co-solvents. The cleaning method may be utilized in a variety of cleaning processes or process steps and offers economic and performance advantages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.