Scalable interpoly dielectric stacks with improved immunity to program saturation
US8021948B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2008 |
| Grant date | Sep 20, 2011 |
| Priority date | — |
| Expiry date | Dec 23, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/685
Abstract
A method for manufacturing a non-volatile memory device is described. The method comprises growing a layer in a siliconoxide consuming material, e.g. DyScO, on top of the upper layer of the layer where charge is stored. A non-volatile memory device is also described. In the non-volatile memory device, the interpoly/blocking dielectric comprises a layer in a siliconoxide consuming material, e.g. DyScO, on top of the upper layer of the layer where charge is stored, the siliconoxide consuming material having consumed at least part of the upper layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.