Silicone resin composition for optical semiconductor devices
US8022137B2 · kind B2 · utility
6Cited by
2References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2009 |
| Grant date | Sep 20, 2011 |
| Priority date | — |
| Expiry date | Sep 29, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/854
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a silicone resin composition for an optical semiconductor device, comprising
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.