Image sensor and manufacturing method for same
US8022453B2 · kind B2 · utility
0Cited by
3References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 4, 2010 |
| Grant date | Sep 20, 2011 |
| Priority date | — |
| Expiry date | Aug 4, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13091
Abstract
An image sensor including a first region where a pad is to be formed, and a second region where a light-receiving element is to be formed. A pad is formed over a substrate of the first region. A passivation layer is formed over the substrate of the first and second regions to expose a portion of the pad. A color filter is formed over the passivation layer of the second region. A microlens is formed over the color filter. A bump is formed over the pad. A protective layer is formed between the bump and the pad to expose the portion of the pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.