Electrostatic chuck
US8023248B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2010 |
| Grant date | Sep 20, 2011 |
| Priority date | — |
| Expiry date | Mar 4, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6833
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrostatic chuck includes a dielectric layer 30 formed with an attraction and fix face onto which a plate member 10 is attracted and fixed, wherein the attraction and fix face of the dielectric layer 30 is formed with a plurality of projection parts 32 each with only a tip face abutting the plate member 10 formed as a flat face by grinding and formed with a coolant gas flow path 36 where a coolant gas flows is opened to the flat face of each of the projection parts 32.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.