Wireless telemetry electronic circuit board for high temperature environments
US8023269B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 15, 2008 |
| Grant date | Sep 20, 2011 |
| Priority date | — |
| Expiry date | Oct 23, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2947
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit assembly (34) resistant to high-temperature and high g centrifugal force is disclosed. A printed circuit board (42) is first fabricated from alumina and has conductive traces of said circuit formed thereon by the use of a thick film gold paste. Active and passive components of the circuit assembly are attached to the printed circuit board by means of gold powder diffused under high temperature. Gold wire is used for bonding between the circuit traces and the active components in order to complete the circuit assembly (34). Also, a method for manufacturing a circuit assembly resistant to elevated temperature is disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.