Circuit board
US8023278B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 14, 2008 |
| Grant date | Sep 20, 2011 |
| Priority date | — |
| Expiry date | Jul 21, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09936
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board includes a plurality of conductive layers, a plurality of insulating layers, a telecommunication network connection port and a modem card processing module. A high voltage signal line is laid out at one of the conductive layers. The insulating layers are disposed between each of the conducting layers, respectively. The telecommunication network connection port is disposed on the conductive layers and is electrically connected to one end of the high voltage signal line. The modem card processing module is disposed on the conductive layers and is electrically connected to the other end of the high voltage signal line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.