Cooling apparatus, systems, and methods
US8024936B2 · kind B2 · utility
12Cited by
54References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2004 |
| Grant date | Sep 27, 2011 |
| Priority date | — |
| Expiry date | Dec 28, 2025 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F13/14
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Apparatus and systems, as well as methods and articles, may operate to actively cool an electronic device using a first heat removing cooling element, and to induce a thermal gradient in a heat pipe by conducting heat from a hot side of the first heat removing cooling element to a cold side of a second heat removing cooling element using the heat pipe. The heat pipe may comprise a variable conductance heat pipe. The apparatus and system may operate in a downhole environment, including logging and drilling operations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.