Radiant heat flooring system
US8025240B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 19, 2006 |
| Grant date | Sep 27, 2011 |
| Priority date | — |
| Expiry date | Jul 27, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B30/00
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A flooring system for radiant heating includes a top floor portion and a subfloor portion. The top portion is releasably connectable to the subfloor portion in a vertical direction substantially perpendicular to a walking surface of the top portion. The top portion includes a bottom side and top channel portion downwardly depending from the bottom side. The subfloor portion includes a top side and a bottom channel portion extending upwardly from the top side. The top channel portion and the bottom channel portion bound a channel for receiving a heating conduit. The channel extends longitudinally relative to the top floor portion and the subfloor portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.