Laser device and method for machining material using laser radiation

US8025659B2 · kind B2 · utility

Assignee

• Carl Zeiss Meditec AG · DE

Inventors

• Mark Bischoff · Jena, DE
• Dirk Muhlhoff · Jena, DE
• Mario Gerlach · Hohen Neuendorf, DE

Key dates

• Filing date: Dec 15, 2004
• Grant date: Sep 27, 2011
• Expiry date: May 10, 2026

Classification

• Technology area (CPC A): Human Necessities
• CPC primary: A61F2009/00872
• WIPO field: Medical technology
• WIPO sector: Instruments

Abstract

Disclosed is a laser device for machining material, comprising a laser beam source which supplies pulsed laser radiation, and a variable deflection unit that introduces said laser radiation into the material at different, selectable points so as to create optical breakthroughs. The inventive laser device further comprises a pulse-selecting apparatus which modifies selected laser pulses of the pulsed laser radiation regarding at least one optical parameter in such a way that no more optical breakthroughs can be created using the modified laser pulses.