Optical bonding composition for LED light source
US8026115B2 · kind B2 · utility
2Cited by
41References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 15, 2007 |
| Grant date | Sep 27, 2011 |
| Priority date | — |
| Expiry date | Jul 5, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Disclosed herein is an optical bonding composition that may be used in optical applications. An LED light source that utilizes the composition is also disclosed, as well as a method of making it. The LED light source may comprise: an LED die; an optical element optically coupled to the LED die; and a bonding layer comprising surface-modified metal oxide nanoparticles in an amorphous silicate network, the bonding layer bonding the LED die and the optical element together. Efficiency of the LED light source may be increased when using an optical extractor as the optical element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.