Method for producing electronic components and pressure sensor
US8026121B2 · kind B2 · utility
3Cited by
8References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2007 |
| Grant date | Sep 27, 2011 |
| Priority date | — |
| Expiry date | Mar 16, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L19/146
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method produces electronic components in particular electronic sensors for pressure and differential pressure measurement. Firstly, the semiconductor structure of the electronic components is produced on a wafer. An insulating oxide layer is then applied. A protective metal layer is subsequently applied. The metal layer is applied in sections only in those regions of the wafer in which no splitting, for example by mechanical separation, occurs later. The electronic components thus formed in the wafer are then divided up into individual elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.