Three-dimensional structures and methods of fabricating the same using a printing plate
US8028621B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 2, 2008 |
| Grant date | Oct 4, 2011 |
| Priority date | — |
| Expiry date | Dec 19, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24612
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods of fabricating three-dimensional structures comprise: contacting a printing plate face with a suspension comprising particles to arrange the particles at predefined positions on the printing plate face, the predefined positions comprising a first position laterally adjacent to a second position; positioning the printing plate with the printing plate face turned toward a substrate and the first position aligned to a protrusion on the substrate; contacting the protrusion with a first layer of particles disposed at the first position of the printing plate to transfer the first layer of particles to a protrusion surface; moving the printing plate laterally to align the second position to the protrusion; and contacting the first layer of particles disposed on the protrusion surface with a second layer of particles disposed at the second position of the printing plate to transfer the second layer of particles to on top of the first layer of particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.