Heat sink system and assembly
US8028744B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2008 |
| Grant date | Oct 4, 2011 |
| Priority date | — |
| Expiry date | Mar 21, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat sink system with reduced airborne debris clogging, for cooling power electronics, the heat sink system including a heat sink having a plurality of fins, a housing configured to direct air flow around the side, top, and/or bottom of the heat sink and then through the fins of the heat sink at a back of the heat sink, and an inlet airway passage formed between a wall of the housing and said side, top, and/or bottom of the finned heat sink to allow air to pass within the housing, wherein said side, top, and/or bottom of the heat sink comprises at least one of said plurality of fins disposed directly in contact with the inlet airway passage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.