Bonding tool, electronic component mounting apparatus and electronic component mounting method
US8028886B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2009 |
| Grant date | Oct 4, 2011 |
| Priority date | — |
| Expiry date | Jan 15, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A bonding tool comprises: a horn which transmits an ultrasonic vibration; a ultrasonic transducer which is provided on one end of the horn, and produces the ultrasonic vibration; a heater disposition part, in which a heater is disposed, which is provided between the one end of the horn and the other end of the horn; a bonding action part which is provided between the one end of the horn and the other end of the horn, holds an electronic component, and is heated by the heater; a first cooling part, through which a fluid flows, which is provided between the heater disposition part and the one end of the horn; and a second cooling part, through which a fluid flows, which is provided between the heater disposition part and the other end of the horn.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.