Electronic inlay structure and method of manufacture thereof
US8028923B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2007 |
| Grant date | Oct 4, 2011 |
| Priority date | — |
| Expiry date | Apr 16, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2457
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An electronic inlay structure including first and second sheets of an inlay substrate arranged in generally side to side, spaced parallel arrangement, having a gap therebetween, a flexible web material arranged to overlie the gap and edges of the first and second sheets of the inlay structure adjacent the gap, third and fourth sheets arranged in registration with the first and second sheets respectively, over the first and second sheets of the inlay substrate and partially over the flexible web material and bonded thereto, electronic circuitry associated with at least one of the first, second, third and fourth sheets and lamination enclosing the first, second, third and fourth sheets, the electronic circuitry and the web material together to create the inlay structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.