Droplet ejection head and droplet ejection apparatus
US8029111B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 4, 2008 |
| Grant date | Oct 4, 2011 |
| Priority date | — |
| Expiry date | Jul 29, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2002/14362
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A droplet ejection head comprises: a substrate having first through-holes forming reservoir chambers, a second through-hole forming a supply chamber, and a bonding film on one surface; a nozzle plate having nozzles for ejecting ejection liquid and one surface contacting the bonding film, the nozzle plate is bonded to the substrate through the bonding film to cover the first through-holes and the second through-hole; a sealing plate on another surface of the substrate covering the first through-holes, one surface of the sealing plate contacting the substrate's another surface; and piezoelectric means on another surface of the sealing plate for driving the droplet ejection head. The bonding film containing an Si-skeleton constituted of constituent atoms containing silicon atoms, with siloxane (Si—O) bonds and elimination groups bonded to the silicon atoms, the constituent atoms being randomly bonded together, and the elimination groups existing near a surface of the bonding film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.