Methods of cutting or forming cavities in a substrate for use in making optical films, components or wave guides
US8029708B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 19, 2009 |
| Grant date | Oct 4, 2011 |
| Priority date | — |
| Expiry date | Jun 19, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/0065
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of forming a varying pattern of optical elements on or in at least one side of an optical panel member involves cutting or forming a pattern or patterns of cavities in a cylindrical or curved substrate or in a sleeve or sleeve segment of the substrate that corresponds to a desired pattern and shape of optical elements to be formed on or in the optical member. The substrate or sleeve or sleeve segment containing the desired pattern or patterns of optical element shaped cavities or depositions or mirror copies or inverse copies thereof is used in production tooling or as a master for production tooling to form the corresponding pattern of optical elements on or in at least the one side of the optical panel member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.