Semiconductor memory device
US8030662B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 8, 2008 |
| Grant date | Oct 4, 2011 |
| Priority date | — |
| Expiry date | Sep 8, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/931
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
There is offered a switching resistance RAM that is very much reduced in an occupied area and is highly integrated. Memory cells CEL11-CEL14 are formed corresponding to four intersections of word lines WL0 and WL1 and bit lines BL0 and BL1. Each of the memory cells CEL11-CEL14 are composed of a switching layer 13 formed on a surface of an N+ type Si layer 11. The switching layer 13 is electrically connected to the bit line BL0 or BL1 thereabove through an electrode 14. The switching layer 13 is composed of a SiC layer 13A stacked on the surface of the N+ type Si layer 11 and a Si oxide layer 13B stacked on the SiC layer 13A. A top surface of the Si oxide layer 13B, that is the uppermost layer of the switching layer 13, is electrically connected to the corresponding bit line BL0 or BL1.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.