Chip cooling channels formed in wafer bonding gap
US8030754B2 · kind B2 · utility
6Cited by
19References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2007 |
| Grant date | Oct 4, 2011 |
| Priority date | — |
| Expiry date | Aug 27, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
One embodiment in accordance with the invention is a system that can include a first wafer and a second wafer. The first wafer and the second wafer can be bonded together by a wafer bonding process that forms a gap between the first wafer and the second wafer. The gap can be configured for receiving a heat extracting material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.