Three-dimensional microstructures and methods of formation thereof
US8031037B2 · kind B2 · utility
44Cited by
22References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2009 |
| Grant date | Oct 4, 2011 |
| Priority date | — |
| Expiry date | Oct 29, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24545
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are affixed to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.