Hermetic liquid crystal cell and sealing technique
US8031319B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 29, 2009 |
| Grant date | Oct 4, 2011 |
| Priority date | — |
| Expiry date | Apr 27, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24455
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Described herein are structures and techniques for providing an LC cell having a hermetically sealed cover disposed over a fill hole provided in a superstrate. The superstrate and cover have adhesion layers disposed thereon. Solder is disposed or otherwise provided around the fill hole (e.g. either on the cover or the superstrate or as a separate piece). The cover is then disposed over the fill hole and the solder is reflowed to form the hermetic seal over the fill hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.