Molded component, electronic apparatus, and method of producing a molded component
US8031462B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2009 |
| Grant date | Oct 4, 2011 |
| Priority date | — |
| Expiry date | Feb 5, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24802
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A molded component includes: a primary molded layer including a boxlike base portion that has a width direction in a first direction, a length direction in a second direction, and a height direction in a third direction and includes a first surface protruding in the third direction and a second surface that forms a spatial portion on the other side of the first surface, and a pedestal portion protruding outwardly in parallel to the first direction and the second direction from a circumferential edge of the base portion; a secondary molded layer formed of an optically-transparent resin material, that is laminated on the primary molded layer and has the same width and length as the primary molded layer; and an in-mold layer formed between the primary molded layer and the secondary molded layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.