Systems and methods for thermal management
US8031470B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 27, 2009 |
| Grant date | Oct 4, 2011 |
| Priority date | — |
| Expiry date | Aug 18, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20518
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for thermal management is provided. The method includes providing thermal isolation between at least one high-power thermally tolerant electronic component and at least one low-power thermally sensitive electronic component housed within an electrical enclosure, providing a first conductive path from the at least one low-power electronic component to a first heatsink, providing a second conductive path from the at least one high-power electronic component to a second heatsink, dissipating heat generated by the at least one low-power thermally sensitive electronic component and dissipating heat generated by the at least one high-power thermally tolerant electronic component to an environment external to the electrical enclosure by channeling the heat generated by the at least one low-power thermally sensitive electronic component and the at least one high-power thermally tolerant electronic component along the first and second conductive path, respectively. The first and second conductive paths are independent from each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.