Manufacturing method for a piezoelectric vibrator
US8032997B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 16, 2010 |
| Grant date | Oct 11, 2011 |
| Priority date | — |
| Expiry date | Aug 16, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A process of manufacturing a piezoelectric vibrator comprises a base substrate; a lid substrate in which cavity recesses are formed and which is bonded to the base substrate in such a state that the recesses face the base substrate; a piezoelectric vibration member bonded to the upper face of the base substrate in such a state that it is housed in the cavity formed of the recess between the base substrate and the lid substrate; an external electrode formed on the lower face of the base substrate; a through- electrode formed in and through the base substrate and electrically connected with the external electrode with keeping the airtightness inside the cavity; and a routing electrode formed on the upper face of the base substrate to electrically connect the through-electrode to the bonded piezoelectric vibration member; wherein the through-electrode is formed in the base substrate by utilizing an electroconductive tack member having a tabular basis part and a core part extending from the basis part toward a direction perpendicular from a surface of the tabular basis part, where the core part is inserted into a through-hole formed in the base substrate and the basis part is removed b…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.