MEMS pressure sensor and housing therefor
US8033177B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2009 |
| Grant date | Oct 11, 2011 |
| Priority date | — |
| Expiry date | Jan 30, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L19/0645
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A pressure sensing system positions a microelectromechanical (MEMS) diaphragm of a MEMS pressure sensor die in a housing to indirectly sample pressure state of a fluid being measured. A second housing diaphragm is used to make direct contact with the fluid being measured. Pressure state of the fluid being measured is transferred from the housing diaphragm through an electrically insulating intermediary fluid to the MEMS diaphragm thereby allowing the MEMS pressure sensor die to indirectly sample pressure state of the fluid being measured. Electrically conductive support members and electrically conductive solid vias are used to electrically couple circuitry of the MEMS pressure sensor die to external wires outside the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.