Segmented grinding wheel and manufacturing method therefor
US8033278B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 13, 2006 |
| Grant date | Oct 11, 2011 |
| Priority date | — |
| Expiry date | Jul 29, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D18/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A plurality of segmented chips are reinforced by applying an adhesive to the circumferentially opposite end portions thereof, and the adjoining segmented chips adjoining in the circumferential direction are adhered to the circumferential surface of a disc-like core with the adhesives at the circumferentially opposite end portions being not jointed with each other. Thus, the segmented chips can be prevented from being loaded with an unnatural force even when the disc-like core with the segmented chips adhered thereto expands and contracts radially due to thermal expansion and thermal contract. Thereby, expansion and contraction of the disc-like core do not impose a compression stress or the like on adhesives situated between adjoining segmented chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.